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    • Intel 1103 Memory chip package, 1970

    • Intel 1103 Memory chip package, 1970

    • Electronic industries; Memory chip packages; Photographs; Santa Clara (Calif.); Santa Clara County (Calif.)--History; Semiconductor wafers; Technology;

    • Color slide of the Intel 1103 Memory chip package. Concept: Ted Hoff. Design: John Reed. This first DRAM is also the first of the chips that would enable the explosive growth of PC's; 1970 MIL became the official second source supplier for Intels...
    • Intel® 1103 DRAM Memory Die, 1970

    • Intel® 1103 DRAM Memory Die, 1970

    • Electronic industries; Memory dies; Photographs; Santa Clara (Calif.); Santa Clara County (Calif.)--History; Semiconductor wafers; Technology;

    • Enlarged color photograph of the Intel® 1103 DRAM Memory Die. Concept: Ted Hoff. Design: John Reed. This first DRAM is also the first of the chips that would enable the explosive growth of PC's; 1970 MIL became the official second source supplier...
    • Intel® Schottky 3101 Bipolar Ram Memory chip package, 1969

    • Intel® Schottky 3101 Bipolar Ram Memory chip package, 1969

    • Electronic industries; Memory chip packages; Photographs; Santa Clara (Calif.); Santa Clara County (Calif.)--History; Technology;

    • Enlarged black-and-white photograph of the Intel® Schottky 3101 Bipolar Ram Memory chip package. The 3101 is the world's first solid state memory device and Intel's first product. The 3101 used Schottky barrier diode, bipolar technology. The...
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